Semiconductor device with a solder bump over a pillar form

Details Semiconductor device with a solder bump over a pillar form Semiconductor device with a solder bump over a pillar form

1997-03-28

2000-02-22

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257738, 257778, H01L 2348

Patent

active

060283572

ABSTRACT:
In a semiconductor device including a semiconductor device chip mounted on a substrate and a solder bump electrode formed on an electrode film of the substrate, a pillar-form conductive paste is formed on a first surface portion of the electrode film, and a solder bump electrode is formed to cover the pillar-form conductive paste and a second surface portion of the electrode film on which the pillar-form conductive paste is not formed. With this arrangement, it is possible to realize a predetermined bump height, and also to prevent a bump from collapsing at the time of mounting.

REFERENCES:
patent: 5468655 (1995-11-01), Greer
patent: 5640052 (1997-06-01), Tsukamoto

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