Flip chip ball grid array package with laminated substrate

Details Flip chip ball grid array package with laminated substrate Flip chip ball grid array package with laminated substrate

1999-05-27

2000-10-17

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438107, 438127, H01L 2144, H01L 2148, H01L 2150

Patent

active

061330647

ABSTRACT:
Methods and apparatus pertaining to flip chip ball grid array packages are disclosed. A substrate comprises a base layer with a dielectric laminated thereon such that a cavity in the dielectric exposes the base layer. A die is then mounted to the exposed portion of the base layer. Preferably, an upper portion of the dielectric forms a frame for receiving a heat spreader.

REFERENCES:
patent: 5473814 (1995-12-01), White
patent: 5767575 (1998-06-01), Lan et al.
patent: 5920126 (1999-07-01), Sohara

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