Flexible printed circuits and methods of fabricating and forming

Details Flexible printed circuits and methods of fabricating and forming Flexible printed circuits and methods of fabricating and forming

1986-09-19

1987-12-29

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 29852, 156150, 156629, 156634, 156645, 156656, 1566591, 156902, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

047159286

ABSTRACT:
Flexible printed circuits and methods of fabricating and forming plated thru-holes therein are disclosed. The flexible printed circuits have one or more substantially rigid regions where plated thru-holes are to be formed, the regions being made rigid by the substitution of epoxy glass or other conventional rigid printed circuit board materials in place of the flexible material used for the flexible portions of the circuit. In this manner the thru-holes are formed through conventional printed circuit board layers, allowing plating of the thru-holes using conventional well developed techniques. This process avoids the necessity of plating thru-holes in flexible printed circuit materials currently requiring special equipment and techniques, and further avoids stress concentration at the junction between the rigid plated thru-holes and the adjacent flexible printed circuit. Various methods for forming such circuits and circuits so formed are disclosed.

REFERENCES:
patent: 4037047 (1977-07-01), Taylor
patent: 4085502 (1978-04-01), Ostman et al.
patent: 4626462 (1986-12-01), Kober

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