Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent
1991-03-25
1994-03-22
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
257618, 257751, H01L 2934, H01L 2702
Patent
active
052967450
ABSTRACT:
A semiconductor device having a moisture barrier comprises a semiconductor substrate, a plurality of bonding pads arranged along at least one side of the semiconductor substrate, and an insulating film provided between at least one side of the semiconductor substrate and the bonding pads opposite to that side, and provided with means for preventing incursion of moisture, thereby to prevent moisture from being absorbed from the chip side surface. Further, there is also disclosed a method of manufacturing such a semiconductor device, which comprises the steps of forming an insulating film on a semiconductor wafer, forming a plurality of bonding pads arranged along dicing lines of the semiconductor wafer, and forming a contact hole or a via hole in the insulating film, and forming at the same time, a groove structure so that it is arranged between the dicing lines and the plurality of bonding pads.
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Shibahara Satoshi
Shirai Kenichi
James Andrew J.
Kabushiki Kaisha Toshiba
Monin D.
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