Semiconductor device and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE27103

Reexamination Certificate

active

08072018

ABSTRACT:
A semiconductor device is provided. The semiconductor device comprises a substrate. A lamination structure is on the substrate along a first direction. The lamination structure comprises a plurality of conductive layers arranged from bottom to top and separated from each other, and each of the conductive layers has a channel region and an adjacent source/drain doped region along the first direction. A first gate structure is on a sidewall of the channel region of each conductive layer. The first gate structure comprises an inner first gate insulating layer and an outer first gate conductive layer.

REFERENCES:
patent: 7005350 (2006-02-01), Walker et al.
patent: 2002/0134755 (2002-09-01), Goto et al.
patent: 2003/0207585 (2003-11-01), Choi et al.
patent: 2006/0001077 (2006-01-01), Ryu et al.
patent: 2006/0017088 (2006-01-01), Abbott et al.
patent: 2008/0073635 (2008-03-01), Kiyotoshi et al.
patent: 2008/0259687 (2008-10-01), Specht et al.
patent: 1901232 (2007-01-01), None
patent: 200713520 (2007-04-01), None
B.E.E. Kastenmeier et al., “Highly selective etching of silicon nitride over silicon and silicon dioxide”, J. Vac. Sci. Technol. A 17(6), Nov./Dec. 1999, p. 3179-3184, US.
Seung-bum Kim et al., “Study on self-aligned contact oxide etching using C5F8/O2/Ar and C5F8/O2/Ar/CH2F2plasma”, J. Vac. Sci. Technol. A 23(4), Jul./Aug. 2005, p. 953-958, US.
Masahiro Ooka et al., “Contact-Hole Etching with NH3-Added C5F8Pulse-Modulated Plasma”, Jpn. J. Appl. Phys., vol. 44, No. 9A, Sep. 8, 2005, p. 6476-6480, Japan.
Taiwan Patent Office, Notice of Allowance, Patent Application Serial No. 096124452, Jan. 28, 2011, Taiwan.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method for fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method for fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for fabricating the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4314585

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.