Extremely thin silicon on insulator (ETSOI) complementary...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S149000, C438S154000, C257S351000, C257S377000

Reexamination Certificate

active

08084309

ABSTRACT:
A method of fabricating an electronic structure is provided that includes forming a first conductivity doped first semiconductor material on the SOI semiconductor layer of a substrate. The SOI semiconductor layer has a thickness of less than 10 nm. The first conductivity in-situ doped first semiconductor material is removed from a first portion of the SOI semiconductor layer, wherein a remaining portion of the first conductivity in-situ doped first semiconductor material is present on a second portion of SOI semiconductor layer. A second conductivity in-situ doped second semiconductor material is formed on the first portion of the SOI semiconductor layer, wherein a mask prohibits the second conductivity in-situ doped semiconductor material from being formed on the second portion of the SOI semiconductor layer. The dopants from the first and second conductivity in-situ doped semiconductor materials are diffused into the first semiconductor layer to form dopant regions.

REFERENCES:
patent: 6084271 (2000-07-01), Yu et al.
patent: 6399970 (2002-06-01), Kubo et al.
patent: 6914303 (2005-07-01), Doris et al.
patent: 2005/0118826 (2005-06-01), Boyd et al.

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