Method for forming post bump

Details Method for forming post bump Method for forming post bump

2010-04-01

2011-12-27

Geyer, Scott B (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S669000, C438S672000

Reexamination Certificate

active

08084349

ABSTRACT:
Disclosed is a method for forming post bumps, the method including the steps of: forming a seed layer for metal plating on a substrate; forming a resist layer having openings provided as positions where the seed layer is subjected to metal plating; forming a dummy sheet, exposing the openings, on the resist layer; forming a post by performing metal plating of the openings; forming solder balls on the post; and removing the dummy sheet and the resist layer.

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