Probing apparatus and method for adjusting probing apparatus

Details Probing apparatus and method for adjusting probing apparatus Probing apparatus and method for adjusting probing apparatus

2006-10-02

2011-11-22

Nguyen, Ha Tran T (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

08063652

ABSTRACT:
The present invention stably maintains contact between probe pins and a wafer. Screws are provided at a plurality of positions in an outer circumferential portion of a printed circuit board. On a lower surface side of the outer circumferential portion of the printed circuit board, a retainer plate is provided, and a bottom end surface of each of the screws is held down with the retainer plate. Turning each of the screws in a state where the bottom end surface of the each of the screws is held down with the retainer plate causes the outer circumferential portion of the printed circuit board to be moved up and down. Adjusting a height of the outer circumferential portion of the printed circuit board by turning each of the screws located at the plurality of positions enables parallelism of the entire probe card with respect to the wafer to be adjusted.

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Notification of Reasons for Refusal in JP Patent Application No. JP2005-327462, Dispatched on Dec. 21, 2010, Japan Patent Office.

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