Electronic component with wire bonds in low modulus fill...

Details Electronic component with wire bonds in low modulus fill... Electronic component with wire bonds in low modulus fill...

2009-02-03

2011-11-22

Ngo, Hung (Department: 2835)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C174S521000, C257S782000, C257S788000, C257S793000

Reexamination Certificate

active

08063318

ABSTRACT:
An electronic component that has a support structure with a plurality of electrical conductors, a series of wire bonds, each of the wire bonds extending from one of the electrical conductors respectively, each of the wire bonds having an end section contacting the electrical conductor and an intermediate section contiguous with the end section, a bead of dam encapsulant encapsulating the electrical conductors and the end section of each of the wire bonds, and a bead of fill encapsulant contacting the bead of dam encapsulant and encapsulating the intermediate portion of each of the wire bonds. The dam encapsulant has a higher modulus of elasticity than the fill encapsulant.

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