Methods of selectively growing nickel-containing materials

Details Methods of selectively growing nickel-containing materials Methods of selectively growing nickel-containing materials

2010-09-20

2011-11-22

Mitchell, James (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S622000

Reexamination Certificate

active

08062969

ABSTRACT:
The invention includes methods of electroless plating of nickel selectively on exposed conductive surfaces relative to exposed insulative surfaces. The electroless plating can utilize a bath which contains triethanolamine, maleic anhydride and at least one nickel salt.

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Baudrand, “Electroless Nickel Plating Surface Engineering”, ASM Handbook vol. 5, pp. 290-310.
Kondo et al., “Acceleration of Electroless Copper Deposition in the Presence of Excess Triethanolamine”, The Electrochemical Society, Inc., 1991, pp. 3629-3633.

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