Through-substrate vias (TSVs) electrically connected to a...

Details Through-substrate vias (TSVs) electrically connected to a... Through-substrate vias (TSVs) electrically connected to a...

2008-10-21

2011-11-08

Crespo, Marcos D Pizarro (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S777000, C257SE23011, C438S667000

Reexamination Certificate

active

08053900

ABSTRACT:
An integrated circuit structure includes a semiconductor chip, which further includes a first surface; and a patterned bond pad exposed through the first surface. The patterned bond pad includes a plurality of portions electrically connected to each other, and at least one opening therein. The integrated circuit further includes a dielectric material filled into at least a portion of the at least one opening.

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