Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Reexamination Certificate
2008-07-17
2011-10-25
Sells, James (Department: 1745)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Presses or press platen structures, per se
C156S580000, C100S25800A
Reexamination Certificate
active
08042593
ABSTRACT:
A semiconductor chip bonding apparatus maintains a semiconductor chip in a parallel state with respect to a lead frame when applying a bonding load.
REFERENCES:
patent: 4797994 (1989-01-01), Michaud et al.
patent: 5667628 (1997-09-01), Kim
patent: 7021208 (2006-04-01), Du et al.
patent: 2006/0048381 (2006-03-01), Woo et al.
patent: 11-238786 (1999-08-01), None
patent: 2002-18795 (2002-03-01), None
patent: 10-546419 (2006-01-01), None
Cho Jeong-Soon
Ha Yong-Dae
Kim Pil-June
Lee Bum-Woo
Lee Jae-Ryoung
Samsung Electronics Co,. Ltd.
Sells James
Stanzione & Kim LLP
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