Semiconductor device including an inner conductive layer...

Details Semiconductor device including an inner conductive layer... Semiconductor device including an inner conductive layer...

2009-09-03

2011-10-25

Arora, Ajay K (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S738000, C257S747000, C257SE23069, C438S613000

Reexamination Certificate

active

08044504

ABSTRACT:
A semiconductor device, includes: an organic multilayer wiring substrate having an inner conductive layer; a semiconductor element mounted and connected on one surface of the wiring substrate; and a plurality of solder balls disposed on the other surface in a grid array. A defect portion is formed at an area corresponding to a corner solder ball disposed at an outer peripheral corner, or at an area corresponding to the corner solder ball and peripheral solder balls at the inner conductive layer. Temperature rises of the solder balls disposed in a vicinity of the corner are suppressed, and therefore, the semiconductor device of which fatigue life is prolonged and superior in reliability can be obtained.

REFERENCES:
patent: 2003/0153160 (2003-08-01), James et al.
patent: 2004/0183205 (2004-09-01), Yamaguchi
patent: 2004/0251544 (2004-12-01), Hussa
patent: 2007/0194433 (2007-08-01), Suwa et al.
patent: 2007-317754 (2007-12-01), None
Zhu, Liping. Thermal Fatigue Reliability Modeling and Analysis of BGA Socket Assembly in System Board with Preloaded Use Condition. 2006. Proceedings of the IEEE 2006 Electronic Components and Technology Conference; pp. 748-755.

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