Semiconductor device having seal ring structure

Details Semiconductor device having seal ring structure Semiconductor device having seal ring structure

2008-07-23

2011-10-18

Dickey, Thomas L (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257SE23001

Reexamination Certificate

active

08039963

ABSTRACT:
A semiconductor device of the present invention includes a seal ring structure. The seal ring structure includes a first metal layer including a though hole, the through hole having a bottom portion filled with an insulating material, and a second metal layer formed on the first metal layer. The second metal layer has a projected portion projecting from a bottom of the second metal layer and the projected portion is inserted into a top portion of the through hole.

REFERENCES:
patent: 5861670 (1999-01-01), Akasaki
patent: 7019400 (2006-03-01), Iguchi et al.
patent: 2004/0188845 (2004-09-01), Iguchi et al.
patent: 2006/0001165 (2006-01-01), Tokitoh et al.
patent: 1532927 (2004-09-01), None
patent: 2005-167198 (2005-06-01), None
patent: 2006-5011 (2006-01-01), None

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