Wafer guide for preventing wafer breakage in semiconductor...

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Reexamination Certificate

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Reexamination Certificate

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08033401

ABSTRACT:
A wafer guide for preventing a wafer breakage in a semiconductor cleaning apparatus includes a lower supporter, side supporters, fixing units and stoppers. The lower supporter is provided with a plurality of slots formed with the same interval in a length direction to vertically stand a plurality of wafers thereon. The side supporters are structured and arranged in parallel at each side above the lower supporter. The side supporters support side end parts of the wafers. The fixing units are adapted to support both end parts of the lower supporter and the side supporters, and may be fixed to a bath. The stoppers are individually coupled to each of the fixing units. The stoppers are operable to generate an error in a close operation of holder units of the robot chuck when the robot chuck deviates from a normal alignment range, so as not to perform a wafer chucking, thereby preventing a wafer breakage during the wafer chucking.

REFERENCES:
patent: 3610613 (1971-10-01), Worden
patent: 4993559 (1991-02-01), Cota
patent: 5301700 (1994-04-01), Kamikawa et al.
patent: 5370142 (1994-12-01), Nishi et al.
patent: 5429251 (1995-07-01), Matthews
patent: 5503173 (1996-04-01), Kudo et al.
patent: 5566076 (1996-10-01), Kuroda
patent: 5590672 (1997-01-01), Ohmori et al.
patent: 6039187 (2000-03-01), Mendiola
patent: 6041938 (2000-03-01), Senn
patent: 6245147 (2001-06-01), Kobayashi
patent: 6520191 (2003-02-01), Iwamoto et al.
patent: 6571964 (2003-06-01), Jacobson et al.
patent: 6871657 (2005-03-01), Bottos et al.
patent: 6939132 (2005-09-01), Loo
patent: 7270240 (2007-09-01), Niese et al.
patent: 7661544 (2010-02-01), Herzog
patent: 2002/0092815 (2002-07-01), Kim et al.
patent: 2003/0085186 (2003-05-01), Fujioka et al.
patent: 2003/0121870 (2003-07-01), Beckhart et al.
patent: 2003/0178379 (2003-09-01), Hasegawa et al.
patent: 2004/0022607 (2004-02-01), Lim et al.
patent: 2005/0145584 (2005-07-01), Buckley et al.
patent: 2006/0027513 (2006-02-01), Jun et al.
patent: 2007/0125726 (2007-06-01), Seo
patent: 2008/0000851 (2008-01-01), Pickering et al.
patent: 2008/0237157 (2008-10-01), Chin et al.
patent: 2009/0008346 (2009-01-01), Aihara et al.
patent: 8-46009 (1996-02-01), None
patent: 2005-0023533 (2005-03-01), None
English language abstract of Japanese Publication No. 8-46009.
English language abstract of Korean Publication No. 2005-0023533.

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