Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2008-06-10
2011-11-08
Kelly, Cynthia (Department: 1722)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
Reexamination Certificate
active
08053175
ABSTRACT:
A method of forming measuring targets for measuring the dimensions of a substrate during a substrate manufacturing process is provided. First, a board having a base layer and a conductive layer is provided, wherein the conductive layer is disposed on a surface of the base layer. Then, at least one through hole is formed in the board as a measuring target for measuring the dimensions of the substrate. Next, a plated via is formed in the through hole as another measuring target for measuring the dimensions of the substrate. Thereafter, a patterned dielectric layer is formed on the board to expose the plated via as a next measuring target for measuring the dimensions of the substrate. In the present invention, measuring targets are formed during a substrate manufacturing process and the dimensions of the substrate are measured instantly. The accuracy in process alignment is improved without increasing the fabrication cost.
REFERENCES:
patent: 6440641 (2002-08-01), Lykins et al.
patent: 2002/0105774 (2002-08-01), Wermer et al.
patent: 2006/0073638 (2006-04-01), Hsu
ASE Electroncis Inc.
J.C. Patents
Kelly Cynthia
Sullivan Caleen
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