Ball grid array integrated circuit package with thermal conducto

Details Ball grid array integrated circuit package with thermal conducto Ball grid array integrated circuit package with thermal conducto

1994-05-16

1996-12-10

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

257712, 257718, 257730, H01L 2310

Patent

active

055833780

ABSTRACT:
A ball grid array package and low cost method for manufacture of the same is disclosed herein. The ball grid array package includes a thermal conductor which is a linearly co-extensive outer layer of an interconnection substrate and forms the outer surface of the ball grid array package. An integrated circuit chip is positioned on the underside of the package in a well region. The well region is either formed directly in the interconnection substrate or is formed by the application of a dam. The well region is then filled with an insulating encapsulant material to a predetermined level.

REFERENCES:
patent: 3926746 (1975-12-01), Hargis
patent: 4681656 (1987-07-01), Byrum
patent: 4792646 (1988-12-01), Enomoto
patent: 4802277 (1989-02-01), Root
patent: 4849856 (1989-07-01), Funari et al.
patent: 4910584 (1990-03-01), Mizuo
patent: 4970579 (1990-11-01), Arldt et al.
patent: 4999740 (1991-03-01), Ilardi et al.
patent: 5027191 (1991-06-01), Bourdelaise et al.
patent: 5045921 (1991-09-01), Lin et al.
patent: 5057969 (1991-10-01), Ameen et al.
patent: 5115964 (1992-05-01), Ameen et al.
patent: 5133495 (1992-07-01), Angulas et al.
patent: 5136366 (1992-08-01), Worp et al.
patent: 5153385 (1992-10-01), Juskey et al.
patent: 5159535 (1992-10-01), Desai et al.
patent: 5170931 (1992-12-01), Desai et al.
patent: 5191511 (1993-03-01), Sawaya
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5261155 (1993-11-01), Angulas et al.
patent: 5280193 (1994-01-01), Lin et al.
patent: 5291062 (1994-03-01), Higgins, III
patent: 5294750 (1994-03-01), Sakai et al.
patent: 5332864 (1994-07-01), Liang et al.
patent: 5345106 (1994-09-01), Doering et al.
patent: 5357672 (1994-10-01), Newman
patent: 5381039 (1995-01-01), Morrison
patent: 5420460 (1995-05-01), Massingill

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