Scribe line structure and method for dicing a wafer

Details Scribe line structure and method for dicing a wafer Scribe line structure and method for dicing a wafer

2009-05-13

2011-10-18

Lebentritt, Michael S (Department: 2829)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S461000, C438S460000, C438S463000, C438S464000, C438S465000, C257S048000, C257S797000, C257S798000

Reexamination Certificate

active

08039367

ABSTRACT:
A scribe line structure is disclosed. The scribe line structure includes a semiconductor substrate having a die region, a die seal ring region, disposed outside the die region, a scribe line region disposed outside the die seal ring region and a dicing path formed on the scribe line region. Preferably, the center line of the dicing path is shifted away from the center line of the scribe line region along a first direction.

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