Substrate inspection apparatus, substrate inspection method...

Radiant energy – Inspection of solids or liquids by charged particles – Electron probe type

Reexamination Certificate

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Details

C250S311000, C250S492100, C250S492220, C430S005000, C438S707000, C438S774000, C356S392000, C356S393000, C356S394000

Reexamination Certificate

active

07838831

ABSTRACT:
A substrate inspection method includes forming a conductive thin film on a surface of an inspection target substrate with a pattern formed thereon, generating an electron beam and irradiating the substrate having the thin film formed thereon with the electron beam, detecting at least any of secondary electrons, reflected electrons and backscattered electrons released from the surface of the substrate and outputting signals constituting an inspection image, and selecting at least any of a material, a film thickness and a configuration for the thin film, or at least any of a material, a film thickness and a configuration for the thin film and an irradiation condition with the electron beam according to an arbitrary inspection image characteristic so that an inspection image according to an inspection purpose can be obtained.

REFERENCES:
patent: 4264822 (1981-04-01), Ueno et al.
patent: 4528452 (1985-07-01), Livesay
patent: 4654649 (1987-03-01), Kojima et al.
patent: 4851097 (1989-07-01), Hattori et al.
patent: 4983830 (1991-01-01), Iwasaki
patent: 5004927 (1991-04-01), Nakagawa
patent: 5022977 (1991-06-01), Matsuoka et al.
patent: 5055696 (1991-10-01), Haraichi et al.
patent: 5214282 (1993-05-01), Yamaguchi et al.
patent: 5350649 (1994-09-01), Okamoto
patent: 5484671 (1996-01-01), Okamoto
patent: 5576833 (1996-11-01), Miyoshi et al.
patent: 5796111 (1998-08-01), Mahoney
patent: 6214738 (2001-04-01), Aiba et al.
patent: 6319321 (2001-11-01), Hiraga et al.
patent: 6541386 (2003-04-01), Aiba et al.
patent: 6548412 (2003-04-01), Fudoji et al.
patent: 6677587 (2004-01-01), Kohama
patent: 6781125 (2004-08-01), Tokuda et al.
patent: 6909092 (2005-06-01), Nagahama et al.
patent: 6914008 (2005-07-01), Den et al.
patent: 6914444 (2005-07-01), Yamada
patent: 6949478 (2005-09-01), Ohmi et al.
patent: 6958477 (2005-10-01), Kohama
patent: 6992290 (2006-01-01), Watanabe et al.
patent: 7075072 (2006-07-01), Hatakeyama et al.
patent: 7098457 (2006-08-01), Nagahama et al.
patent: 7212017 (2007-05-01), Watanabe et al.
patent: 7241993 (2007-07-01), Nakasuji et al.
patent: 7323814 (2008-01-01), Miyazaki et al.
patent: 7351969 (2008-04-01), Watanabe et al.
patent: 7391036 (2008-06-01), Hatakeyama et al.
patent: 7411191 (2008-08-01), Nakasuji et al.
patent: 7439502 (2008-10-01), Nakasuji et al.
patent: 7449691 (2008-11-01), Hatakeyama et al.
patent: 7550750 (2009-06-01), Tokuda et al.
patent: 7592586 (2009-09-01), Watanabe et al.
patent: 2005/0205783 (2005-09-01), Nagahama et al.
patent: 2007/0114463 (2007-05-01), Nakasugi et al.
patent: 2007/0278418 (2007-12-01), Zani et al.
patent: 2007/0278419 (2007-12-01), Zani et al.
patent: 2008/0173814 (2008-07-01), Watanabe et al.
patent: 2008/0265159 (2008-10-01), Hatakeyama et al.
patent: 2009/0032708 (2009-02-01), Nakasuji et al.
patent: 2009/0042106 (2009-02-01), Nagamura et al.
patent: 2009/0101816 (2009-04-01), Noji et al.
patent: 2009/0212213 (2009-08-01), Nakasuji et al.
patent: 2010/0019149 (2010-01-01), Watanabe et al.
patent: 4-242060 (1992-08-01), None
patent: 11-326247 (1999-11-01), None
patent: 2004-354084 (2004-12-01), None
K. Tsuno, “Simulation of a Wien filter as beam separator in a low energy electron microscope,” Ultramicroscopy 55 (1994), pp. 127-140.

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