Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2008-11-13
2010-06-29
Lee, Sin J. (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S326000, C430S325000, C430S330000, C560S059000, C560S064000, C560S073000, C528S361000
Reexamination Certificate
active
07745099
ABSTRACT:
A photosensitive compound as a molecular resist whose size is smaller than conventional polymer for photoresist, and which can form a nano assembly, and a photoresist composition including the same are disclosed. The photosensitive compound represented by the following formula. Also, the present invention provides a photoresist composition comprising 1 to 85 wt % (weight %) of the photosensitive compound; 0.05 to 15 weight parts of a photo-acid generator with respect to 100 weight parts of the photosensitive compound; and 50 to 5000 weight parts of an organic solvent with respect to 100 weight parts of the photosensitive compound.In the formula, n is the number of repetition of an isopropyl oxide (—CH(CH3)CH2O—) monomer, and is an integer of 1 to 40, and R is an alkyl group of 1 to 20 carbon atoms or a cycloalkyl group of 3 to 20 carbon atoms.
REFERENCES:
Cho et al (“Supramolecular Nanostructures from Side Chain Rod-Coil Polymer Self-Assembly” Macromolecules, 2002, 35(12), p. 4845-4848.
Kim Deog-Bae
Kim Jae-Hyun
Kim Jung-Woo
Birch & Stewart Kolasch & Birch, LLP
Dongjin Semichem Co., Ltd.
Lee Sin J.
LandOfFree
Photosensitive compound and photoresist composition... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photosensitive compound and photoresist composition..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive compound and photoresist composition... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4241987