Plastic package semiconductor device with thermal stress resista

Details Plastic package semiconductor device with thermal stress resista Plastic package semiconductor device with thermal stress resista

1990-07-10

1992-05-26

Hille, Rolf

357 68, 357 70, 357 71, H01L 2328, H01L 2348, H01L 2944, H01L 2952

Patent

active

051172801

ABSTRACT:
A wiring formed in the uppermost level of a plastic encapsulated semiconductor device is fixed by connecting it to anchor wirings provided in a lower level via through holes in order to suppress a shear deformation of the uppermost level wiring. The independent wirings are formed in an islandshaped pattern and have no electrical connection to any circuit elements per se.

REFERENCES:
patent: 4884123 (1989-11-01), Dixit
patent: 4916521 (1990-04-01), Yoshikawa et al.
patent: 4970574 (1990-11-01), Tsunenari

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