Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Diffusing a dopant
Patent
1997-03-31
1999-03-02
Niebling, John F.
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Diffusing a dopant
438783, 438301, H01L 21385
Patent
active
058770720
ABSTRACT:
A process for doping a region in a substrate from a solid phase source. An inert gas is bubbled through a dopant containing ester and supplied to a chamber along with the gases used to form a silicon dioxide layer such as a TEOS formed layer. The flow of the inert gas can be modulated to grade the dopant concentration in the silicon dioxide layer. The dopant is diffused from the silicon dioxide layer into the substrate to form, for instance, source and drain regions in field-effect transistors.
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"A New Half-Micron p-Channel Mosfet with Latips" (LARGE-TILT-ANGLE IMPLANTED PUNCH THROUGH STOPPER), Hori & Kurimoto, IEDM 88.beginning at p. 394.
Andideh Ebrahim
Thompson Scott E.
Intel Corporation
Mulpuri S.
Niebling John F.
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