Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2007-11-28
2010-06-15
Zarneke, David A (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S701000, C257S773000, C257SE23011, C257SE23004, C257SE23009
Reexamination Certificate
active
07737562
ABSTRACT:
A collective substrate has through-holes. The through-holes each have an interior surface including taper surfaces which are tapered as having an opening size progressively decreasing from a main surface and an external connection surface toward a minimum size hole portion. A semiconductor element mount includes an insulative member cut out of the collective substrate. An imaging device includes an imaging element mounted in a region surrounded by a frame which is bonded to the main surface of the insulative member and closed by a cover. A light emitting diode component includes a light emitting element mounted on the main surface of the insulative member with the minimum size hole portion of the through-hole being filled with an electrically conductive material, the light emitting element being sealed with a fluorescent material and/or a protective resin.
REFERENCES:
patent: 5670797 (1997-09-01), Okazaki
patent: 5814837 (1998-09-01), Okazaki
patent: 5882949 (1999-03-01), Okazaki
patent: 5928768 (1999-07-01), Ikeda et al.
patent: 6008537 (1999-12-01), Kosaki et al.
patent: 6114240 (2000-09-01), Akram et al.
patent: 6157077 (2000-12-01), Matsuoka et al.
patent: 6329671 (2001-12-01), Tamaki et al.
patent: 6452278 (2002-09-01), DiCaprio et al.
patent: 7205635 (2007-04-01), MacIntyre
patent: 2001/0036506 (2001-11-01), Yamamoto et al.
patent: 2005/0036278 (2005-02-01), Murakami et al.
patent: 1414643 (2003-04-01), None
patent: 05-090548 (1993-04-01), None
patent: 07-235621 (1995-09-01), None
patent: 8-213660 (1996-08-01), None
patent: 09-036432 (1997-02-01), None
patent: 11-074410 (1999-03-01), None
patent: 11-135906 (1999-05-01), None
patent: 11-238830 (1999-08-01), None
patent: 2001-94041 (2001-04-01), None
patent: 2002-16341 (2002-01-01), None
patent: 2002-232017 (2002-08-01), None
patent: 2003-282795 (2003-10-01), None
patent: 2004-207592 (2004-07-01), None
patent: 2006-49551 (2006-02-01), None
Higaki Kenjiro
Ishidu Sadamu
Takagi Daisuke
Tsuzuki Yasushi
A. L. M. T. Corp.
Rabin & Berdo PC
Zarneke David A
LandOfFree
Semiconductor element mount, semiconductor device, imaging... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor element mount, semiconductor device, imaging..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor element mount, semiconductor device, imaging... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4209422