Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2010-01-12
2010-11-23
Monbleau, Davienne (Department: 2893)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S664000, C257SE25013, C257SE23010, C257SE23079, C257SE21508
Reexamination Certificate
active
07838409
ABSTRACT:
One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.
REFERENCES:
patent: 6869825 (2005-03-01), Chiu
patent: 7294827 (2007-11-01), Tan
patent: 7425760 (2008-09-01), Guenin et al.
Drost Robert J.
Guenin Bruce M.
Ho Ronald
Zingher Arthur R.
Harrison Monica D
Monbleau Davienne
Oracle America Inc.
Park Vaughan Fleming & Dowler LLP
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