Bonding pad for preventing pad peeling and method for...

Details Bonding pad for preventing pad peeling and method for... Bonding pad for preventing pad peeling and method for...

2008-06-30

2010-10-05

Le, Thao P. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S459000

Reexamination Certificate

active

07807559

ABSTRACT:
A bonding pad includes multiple metal layers, insulation layers filled between the multiple metal layers, and a fixing pin coupled between the uppermost metal layer, where a bonding is performed, and the underlying metal layers. Peeling of the bonding pad can be prevented during the ball bonding by forming the fixing pin coupled to the edges of the bonding pad. The upper portion of the fixing pin is formed in a disk shape and a ball portion of the fixing pin is fixed by slits such that the peeling of the bonding pad can be further prevented.

REFERENCES:
patent: 2006/0043599 (2006-03-01), Akram et al.
patent: 2006/0063374 (2006-03-01), Lin et al.
patent: 2008/0237849 (2008-10-01), Pratt
patent: 2009/0152727 (2009-06-01), Kim
patent: 2009/0267194 (2009-10-01), Chen
patent: 2003-282573 (2003-10-01), None
patent: 2007-012646 (2007-01-01), None
patent: 1020000018729 (2000-04-01), None
patent: 1020010062344 (2001-07-01), None

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