Semiconductor transducer or actuator utilizing corrugated suppor

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

296211, 156651, 156657, 1566591, 1566611, 156662, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

051164574

ABSTRACT:
A semiconductor transducer or acutator is disclosed. The transducer and actuator each include a deflecting member with corrugations producing increased vertical travel which is a linear function of applied force. An accurate and easily controlled method that is insensitive to front-to-back alignment is also disclosed for forming uniform corrugations of precise thickness; independent of the thickness of the deflecting member. The cross-sectional shape of the corrugations is not limited by the etching technique, so that any configuation thereof is enabled.

REFERENCES:
patent: 4685996 (1989-08-01), Busta
patent: 4981552 (1991-01-01), Mikkor
patent: 5024953 (1991-06-01), Uematsu et al.
patent: 5045152 (1991-09-01), Sickafus

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