Semiconductor device, electro-optical device, and method for...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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Details

C438S149000, C438S151000, C438S155000

Reexamination Certificate

active

07855107

ABSTRACT:
A method for manufacturing a semiconductor apparatus, the method including: aligning, on a temporal substrate, the plurality of device chips approximately in an L-shape, a plurality of groups of device chips, each group of device chips including a plurality of device chips aligned in an L-shape; arranging the plurality of groups of the device chips in a plurality of arrays on the temporal substrate, each array of device chips arranged in a band-shape, from a first long side to a second long side of the temporal substrate, a front of the band-shape being a corner of a perimeter of each group; delaminating a group of the device chips as one unit from the temporal substrate, and transferring onto the surface of the flexible substrate; and coupling each of the device chips in the group of device chips with the circuit on the flexible substrate.

REFERENCES:
patent: 5766977 (1998-06-01), Yamazaki
patent: 2007/0091062 (2007-04-01), French et al.
patent: 2008/0012121 (2008-01-01), Hara
patent: A-8-264800 (1996-10-01), None
patent: A 2002-182580 (2002-06-01), None
patent: A 2003-518756 (2003-06-01), None
patent: A-2003-295783 (2003-10-01), None
patent: A 2003-297974 (2003-10-01), None
patent: A-2004-96018 (2004-03-01), None
patent: A 2005-114915 (2005-04-01), None
patent: A-2005-259984 (2005-09-01), None

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