Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2006-03-21
2010-02-23
Ghyka, Alexander G (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S106000, C438S110000, C257S414000, C257S528000
Reexamination Certificate
active
07666698
ABSTRACT:
A method is provided for constructing a microelectronic assembly. A semiconductor substrate having a MEMS device formed on a first portion thereof, a semiconductor device formed on a second portion thereof, and a build up layer having a first portion formed over the MEMS device and a second portion formed over the semiconductor device is provided. The first portion of the build up layer over the MEMS device is removed. A release body is formed adjacent to the MEMS device. A structural material is formed over the release body. An opening is formed in the structural material to expose the release body. The release body is removed through the opening to form a cavity between the MEMS device and the structural material. The opening in the structural material is sealed with a sealing material.
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Chang Leonard
Freescale Semiconductor Inc.
Ghyka Alexander G
Ingrassia Fisher & Lorenz P.C.
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