Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2007-03-29
2010-10-19
Parker, Kenneth A. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C324S252000, C361S813000, C257S692000, C257S684000, C257S701000, C257S685000
Reexamination Certificate
active
07816772
ABSTRACT:
Methods and apparatus for providing an integrated circuit using a multi-stage molding process to protect wirebonds. In one embodiment, a method includes attaching a die to a leadframe having a lead finger, attaching a wirebond between the die and the leadfinger, applying a first mold material over at least a portion of the wirebond and the die and the leadfinger to form an assembly, waiting for the first mold material to at least partially cure, and applying a second mold material over the assembly.
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Engel Raymond W.
Sharma Nirmal
Taylor William P.
Allegro Microsystems Inc.
Daly, Crowley & Mofford & Durkee, LLP
Nguyen Joseph
Parker Kenneth A.
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