4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. For high frequency device

Nirmal Sharma

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Current sensor

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Matched impedance bonding technique in high-speed integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

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Methods and apparatus for multi-stage molding of integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2681781

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