Method of processing organic film using plasma etching and...

Details Method of processing organic film using plasma etching and... Method of processing organic film using plasma etching and...

2006-02-07

2010-02-09

Culbert, Roberts (Department: 1792)

Etching a substrate: processes

Gas phase etching of substrate

Application of energy to the gaseous etchant or to the...

C438S710000

Reexamination Certificate

active

07658859

ABSTRACT:
A method of forming an organic film disposes a substrate on which the organic film is formed in a chamber capable of reducing a pressure therein, introduces a gas including a deuterium compound or a trideuterium compound in the chamber, to generate a plasma by ionizing the gas; and etches and patterning the organic film by the plasma.

REFERENCES:
patent: 5730808 (1998-03-01), Yang et al.
patent: 6277733 (2001-08-01), Smith
patent: 6444533 (2002-09-01), Lyding et al.
patent: 6599829 (2003-07-01), Smith et al.
patent: 6635185 (2003-10-01), Demmin et al.
patent: 6888204 (2005-05-01), Lyding et al.
patent: 7001848 (2006-02-01), Smith et al.
patent: 2002/0127840 (2002-09-01), Smith et al.
patent: 2003/0216026 (2003-11-01), Mukherjee-Roy et al.
patent: 2004/0121609 (2004-06-01), Lee et al.
patent: 2006/0281312 (2006-12-01), Smith et al.
patent: 6-84841 (1994-03-01), None
patent: 2002-93778 (2002-03-01), None
patent: 2002-543613 (2002-12-01), None
patent: WO 2004/027826 (2004-04-01), None
Notification of Reason for Rejection issued by the Japanese Patent Office on Nov. 4, 2008, for Japanese Patent Application No. 2005-032169, and English-language translation thereof.

Affiliated with

Also associated with

Rating

Method of processing organic film using plasma etching and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of processing organic film using plasma etching and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of processing organic film using plasma etching and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4163909