Low frequency quartz based MEMS resonators and method of...

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

Reexamination Certificate

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C310S321000, C310S322000, C310S324000

Reexamination Certificate

active

07851971

ABSTRACT:
A method for fabricating a low frequency quartz resonator includes metalizing a top-side of a quartz wafer with a metal etch stop, depositing a first metal layer over the metal etch stop, patterning the first metal layer to form a top electrode, bonding the quartz wafer to a silicon handle, thinning the quartz wafer to a desired thickness, depositing on a bottom-side of the quartz wafer a hard etch mask, etching the quartz wafer to form a quartz area for the resonator and to form a via through the quartz wafer, removing the hard etch mask without removing the metal etch stop, forming on the bottom side of the quartz wafer a bottom electrode for the low frequency quartz resonator, depositing metal for a substrate bond pad onto a host substrate wafer, bonding the quartz resonator to the substrate bond pad, and removing the silicon handle.

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patent: 4442574 (1984-04-01), Wanuga et al.
patent: 5480747 (1996-01-01), Vasudev
patent: 5666706 (1997-09-01), Tomita et al.
patent: 6362561 (2002-03-01), Kuroda et al.
patent: 6528924 (2003-03-01), Stelzl et al.
patent: 7237315 (2007-07-01), Kubena et al.

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