Semiconductor device production method that includes forming...

Details Semiconductor device production method that includes forming... Semiconductor device production method that includes forming...

2007-12-27

2010-02-16

Smoot, Stephen W (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S627000, C438S650000, C438S686000, C257SE21584

Reexamination Certificate

active

07662713

ABSTRACT:
A semiconductor device provided with: a first interconnection layer provided on a semiconductor substrate; an interlevel insulation film provided over the first interconnection layer; a barrier layer provided between the first interconnection layer and the interlevel insulation film; and a second interconnection layer of gold provided as an uppermost interconnection layer on the interlevel insulation film. The barrier layer is formed in a region of the first interconnection layer including an interlevel connection opening region of the interlevel insulation, and the region is greater than the interlevel connection opening region. The second interconnection layer is electrically connected to the first interconnection layer via the barrier layer in the interlevel connection opening.

REFERENCES:
patent: 6037664 (2000-03-01), Zhao et al.
patent: 6143646 (2000-11-01), Wetzel
patent: 6255226 (2001-07-01), Zheng et al.
patent: 6271127 (2001-08-01), Liu et al.
patent: 6475836 (2002-11-01), Suzawa et al.
patent: 6495879 (2002-12-01), Kobayashi
patent: 6548900 (2003-04-01), Kusumi
patent: 6586347 (2003-07-01), Liu et al.
patent: 2002/0132392 (2002-09-01), Nakatani et al.
patent: 2003/0111735 (2003-06-01), Lee
patent: 04-196251 (1992-07-01), None
patent: 07-183377 (1995-07-01), None
patent: 07-263555 (1995-10-01), None
patent: 2000-349300 (2000-12-01), None

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