Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2006-06-26
2009-11-10
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S127000
Reexamination Certificate
active
07615395
ABSTRACT:
A method of enclosing a micromechanical element formed between a base layer and one or more metallization layers includes forming one or more encapsulating layers over the micromechanical element and providing an encapsulating wall surrounding the element extending between the base layer and the one or more encapsulating layers. An electrical connection is provided between the base layers and the one or more metallization layers formed above the micromechanical element.
REFERENCES:
patent: 5504026 (1996-04-01), Kung
patent: 5919548 (1999-07-01), Barron et al.
patent: 6012336 (2000-01-01), Eaton et al.
patent: 6174820 (2001-01-01), Habermehl et al.
patent: 6635509 (2003-10-01), Ouellet
patent: 6861277 (2005-03-01), Monroe et al.
patent: 6936494 (2005-08-01), Cheung
patent: 7008812 (2006-03-01), Carley
patent: 2001/0023991 (2001-09-01), Kakuhara
patent: 2002/0011645 (2002-01-01), Bertin et al.
patent: 2002/0064906 (2002-05-01), Enquist
patent: 2002/0193037 (2002-12-01), Hofmann et al.
patent: 2003/0001221 (2003-01-01), Fischer et al.
patent: 2003/0148550 (2003-08-01), Volant et al.
patent: 2003/0153116 (2003-08-01), Carley et al.
patent: 2004/0157426 (2004-08-01), Ouellet et al.
patent: 2004/0159532 (2004-08-01), Tatic-Lucic et al.
patent: 2004/0166603 (2004-08-01), Carley
patent: 2004/0188785 (2004-09-01), Cunningham et al.
patent: 2004/0245588 (2004-12-01), Nikkel et al.
patent: 2005/0037608 (2005-02-01), Andricacos et al.
patent: 2005/0164127 (2005-07-01), Reid et al.
patent: 2006/0134825 (2006-06-01), DCamp et al.
patent: 2006/0220173 (2006-10-01), Gan et al.
patent: 100 56 716 (2002-05-01), None
patent: 0 751 546 (1997-01-01), None
patent: 0 783 182 (1997-07-01), None
patent: 1 041 629 (2000-10-01), None
patent: 1 450 406 (2004-08-01), None
patent: 1 450 406 (2004-08-01), None
patent: 63-198378 (1988-08-01), None
patent: 63-307758 (1988-12-01), None
patent: 05-297413 (1993-11-01), None
patent: 09-257618 (1997-10-01), None
patent: 11-177067 (1999-07-01), None
patent: 2000-186931 (2000-07-01), None
patent: 2001-133703 (2001-05-01), None
patent: 2002-280470 (2002-09-01), None
patent: 2003-035874 (2003-02-01), None
patent: 2003-506871 (2003-02-01), None
patent: WO 97/07517 (1997-02-01), None
patent: WO 00/24021 (2000-04-01), None
patent: WO 00/33089 (2000-06-01), None
patent: WO 01/31664 (2001-05-01), None
patent: WO 01/56066 (2001-08-01), None
patent: WO 01/83363 (2001-11-01), None
patent: WO 01/92842 (2001-12-01), None
patent: WO 02/16150 (2002-02-01), None
patent: WO 02/063657 (2002-08-01), None
patent: WO 03/028059 (2003-04-01), None
patent: WO 03/069645 (2003-08-01), None
patent: WO-03/085719 (2003-10-01), None
patent: WO 2004/096696 (2004-11-01), None
patent: WO 2005/060002 (2005-06-01), None
patent: WO 2005/061376 (2005-07-01), None
patent: WO 2007/015097 (2007-02-01), None
patent: WO 2007/017672 (2007-02-01), None
patent: WO 2007/060414 (2007-05-01), None
patent: WO 2007/060416 (2007-05-01), None
H. Stahl, et al., “Thin Film Encapsulation of Acceleration Sensors Using Polysilicon Sacrificial Layers,” IEEE, pp. 1899-1902.
Chan, et al. “Comprehensive Static Characterization of Vertical Electrostatically Actuated Polysilicon Beams” vol. 16, No. 4, dated Oct. 1999, pp. 58-65.
International Preliminary Report and Written Opinion for International Application No. PCT/GB2006/002959 dated Feb. 5, 2008.
International Preliminary Report and Written Opinion for International Application No. PCT/GB2006/004350 dated May 27, 2008.
International Preliminary Report and Written Opinion for International Application No. PCT/GB2006/004354 dated May 27, 2008.
International Preliminary Report on Patentability for International Application No. PCT/GB2004/005122 dated Nov. 16, 2005.
International Preliminary Report on Patentability for International Application No. PCT/GB2004/001773 dated Jun. 22, 2008.
International Search Report for International Application No. PCT/GB2006/004354 dated Mar. 12, 2007.
International Search Report for International Application No. PCT/GB2006/002959 dated Oct. 25, 2006.
International Search Report for International Application No. PCT/GB2006/004350 dated Mar. 12, 2007.
International Search Report for International Application No. PCT/GB2004/005122 dated Mar. 2, 2005.
International Search Report for International Application No. PCT/GB2004/001773 dated Sep. 6, 2004.
Mercado, et al. “A mechanical approach to overcome RF MEMS switch stiction problem” vol. conf. 53, dated May 27, 2003, pp. 377-384.
Stahl, et al. “Thin film encapsulation of acceleration sensors using polysilicon sacrificial layers” vol. 22, dated Jun. 9, 2003, pp. 1899-1902.
Written Opinion for International Application No. PCT/GB2004/001773 dated Sep. 6, 2004.
Written Opinion of the International Searching Authority for International Application No. PCT/GB2004/005122 dated Feb. 28, 2005.
Zavracky, et al. “Micromechanical Switches Fabricated Using Nickel Surface Micromachining” Journal of Microelectromechanical Systems, IEEE Service Center, Piscataway, NJ, US, vol. 6, No. 1, dated Mar. 1997.
Notification of Reasons for Rejection dated Feb. 17, 2009 for Japanese Patent Application No. 2006-546296 (CK004JP) and English translation thereof.
Notification of the First Office Action for Chinese Patent Application No. 200480039028.0 (CK004—China) dated Feb. 27, 2009.
Office Action for European Patent Application No. 04805944.8 dated Jun. 22, 2009 (CK004EP).
Cavendish Kinetics Limited
Mulpuri Savitri
Patterson & Sheridan LLP
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