Thick film photoresist composition and method of forming...

Details Thick film photoresist composition and method of forming... Thick film photoresist composition and method of forming...

2004-11-18

2009-10-06

Walke, Amanda C. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S281100, C430S286100, C430S287100, C430S905000, C430S913000

Reexamination Certificate

active

07598014

ABSTRACT:
A negative thick film photoresist composition with improved alkali developability is provided. The composition comprises: (A) a resin component containing (a) from 61 to 90% by weight of a structural unit derived from a cyclic alkyl (meth)acrylate ester, and (b) a structural unit derived from a radical polymerizable compound containing a hydroxyl group, (B) a polymerizable compound containing at least one ethylenic unsaturated double bond, (C) a photopolymerization initiator, and (D) an organic solvent.

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Office Action issued on counterpart Japanese Patent Application No. 2004-265693, dated May 7, 2009.

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