Method and structure for strained FinFET devices

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S401000

Reexamination Certificate

active

07602021

ABSTRACT:
A method (and structure) of forming an electronic device includes forming at least one localized stressor region within the device.

REFERENCES:
patent: 5461250 (1995-10-01), Burghartz et al.
patent: 6342410 (2002-01-01), Yu
patent: 6475869 (2002-11-01), Yu
patent: 6909151 (2005-06-01), Hareland et al.
patent: 6921913 (2005-07-01), Yeo et al.
patent: 7064396 (2006-06-01), Chen et al.
patent: 7205615 (2007-04-01), Tsutsui et al.
patent: 2003/0102497 (2003-06-01), Fried et al.
patent: 2004/0075148 (2004-04-01), Kumagai et al.
patent: 2004/0108559 (2004-06-01), Sugii et al.
patent: 2004/0173812 (2004-09-01), Currie et al.
patent: 2004/0173815 (2004-09-01), Yeo et al.
patent: 2004/0227185 (2004-11-01), Matsumoto et al.
patent: 2004/0259315 (2004-12-01), Sakaguchi et al.
patent: 2005/0079677 (2005-04-01), Ke et al.
patent: 2005/0190421 (2005-09-01), Chen et al.

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