Stacked-type semiconductor device package

Details Stacked-type semiconductor device package Stacked-type semiconductor device package

2007-12-20

2009-11-10

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23010

Reexamination Certificate

active

07615858

ABSTRACT:
A stacked-type semiconductor device package is provided. The stacked-type semiconductor device package includes a plurality of stacked semiconductor chip packages with joining electrodes exposed on sides of the semiconductor chip packages and a flexible printed circuit board (flexible PCB) on which the stacked semiconductor chip packages are mounted. The flexible PCB includes a first surface having connecting electrodes corresponding to the joining electrodes of the stacked semiconductor chip packages and a second surface opposite the first surface. The flexible PCB covers the sides of the stacked semiconductor chip packages, and the connecting electrodes of the first surface are connected to the joining electrodes of the stacked semiconductor chip packages.

REFERENCES:
patent: 5466634 (1995-11-01), Beilstein, Jr. et al.
patent: 6884654 (2005-04-01), King et al.
patent: 2003-017617 (2003-01-01), None
patent: 2003017617 (2003-01-01), None
patent: 2006-216692 (2006-08-01), None
patent: 2006-278975 (2006-10-01), None
patent: 2005-0048123 (2005-05-01), None
English language abstract of Japanese Publication No. 2003-017617.

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