Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Reexamination Certificate
2006-05-25
2009-10-27
Vu, David (Department: 2818)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
C257S059000, C257S291000, C438S151000, C349S042000, C349S043000, C349S044000, C349S045000, C349S047000
Reexamination Certificate
active
07608490
ABSTRACT:
To provide a semiconductor device having a circuit with high operating performance and high reliability, and improve the reliability of the semiconductor device, thereby improving the reliability of an electronic device having the same. The aforementioned object is achieved by combining a step of crystallizing a semiconductor layer by irradiation with continuous wave laser beams or pulsed laser beams with a repetition rate of 10 MHz or more, while scanning in one direction; a step of photolithography with the use of a photomask or a leticle including an auxiliary pattern which is formed of a diffraction grating pattern or a semi-transmissive film having a function of reducing the light intensity; and a step of performing oxidation, nitridation, or surface-modification to the surface of the semiconductor film, an insulating film, or a conductive film, with high-density plasma with a low electron temperature.
REFERENCES:
patent: 6521912 (2003-02-01), Sakama et al.
patent: 6624864 (2003-09-01), Kubo et al.
patent: 6809023 (2004-10-01), Arai et al.
patent: 6818852 (2004-11-01), Ohmi et al.
patent: 6919282 (2005-07-01), Sakama et al.
patent: 7226848 (2007-06-01), Sugawara et al.
patent: 7226874 (2007-06-01), Matsuyama et al.
patent: 2002/0020497 (2002-02-01), Ohmi et al.
patent: 2002/0025591 (2002-02-01), Ohnuma et al.
patent: 2002/0031876 (2002-03-01), Hara et al.
patent: 2002/0102783 (2002-08-01), Fujimoto et al.
patent: 2002/0146872 (2002-10-01), Arai et al.
patent: 2003/0094611 (2003-05-01), Hayakawa
patent: 2004/0007748 (2004-01-01), Sakama et al.
patent: 2004/0050494 (2004-03-01), Ohmi et al.
patent: 2004/0217431 (2004-11-01), Shimada
patent: 2005/0115930 (2005-06-01), Tanaka et al.
patent: 2005/0139786 (2005-06-01), Tanaka et al.
patent: 2005/0263835 (2005-12-01), Sakama et al.
patent: 2006/0014335 (2006-01-01), Ohnuma et al.
patent: 1505641 (2005-02-01), None
patent: 1 617 483 (2006-01-01), None
patent: 1 622 194 (2006-02-01), None
patent: 2001-135824 (2001-05-01), None
patent: 2002-151523 (2002-05-01), None
patent: 2002-203862 (2002-07-01), None
patent: 2004-319952 (2004-11-01), None
patent: WO 2004/017396 (2004-02-01), None
patent: WO 2005/004223 (2005-01-01), None
Office Action (Chinese Patent Application No. 200610092457.5) Dated Feb. 27, 2009.
Kakehata Tetsuya
Komori Shigeki
Nagai Masaharu
Ohnuma Hideto
Osame Mitsuaki
Fox Brandon
Robinson Eric J.
Robinson Intellectual Property Law Office P.C.
Semiconductor Energy Laboratory Co,. Ltd.
Vu David
LandOfFree
Semiconductor device and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and manufacturing method thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4131506