Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-01-08
2009-02-17
Ghyka, Alexander G (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C257SE21001, C257SE23080, C257S706000, C257S713000
Reexamination Certificate
active
07491577
ABSTRACT:
An apparatus for providing thermal management on high-power integrated circuit devices is disclosed. Initially, contacts to active devices are formed. Phase change materials are then applied over potential hot spots that can be formed by the active devices. A layer of high-thermally conductive materials is deposited over the phase change materials. The layer of high-thermally conductive materials and the phase change materials are subsequently etched according to a pattern. A layer of passivation conductive vias is subsequently applied to the phase change materials to complete the formation of phase change heatsinks.
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McIntyre Thomas J.
Sturcken Keith K.
BAE Systems Information and Electronic Systems Integration Inc.
Dillon & Yudell LLP
Ghyka Alexander G
Long Daniel J.
Ng Antony P.
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