4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Keith K. Sturcken

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Article comprising a multi-layer electronic package and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Ball grid array (BGA) to column grid array (CGA) conversion...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Insitu radiation protection of integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Insitu radiation protection of integrated circuits

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Integrated circuit package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2139240

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