Semiconductor device and package including the same

Details Semiconductor device and package including the same Semiconductor device and package including the same

2007-12-28

2009-12-01

Dang, Phuc T (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257SE23021, C438S613000, C438S614000

Reexamination Certificate

active

07626263

ABSTRACT:
Provided is a semiconductor device. The semiconductor device includes a first bump column on an active surface of the semiconductor device and including a plurality of first bumps spaced a first distance from an edge of the semiconductor device, a second bump column on the active surface and including a plurality of second bumps spaced a second distance that is greater than the first distance from the edge of the semiconductor device, and a third bump column on the active surface, and including a plurality of third bumps spaced a third distance that is greater than the second distance from the edge of the semiconductor device. The second bumps and the third bumps are sequentially alternated at least twice between the first bumps.

REFERENCES:
patent: 6472727 (2002-10-01), Miyazaki et al.
patent: 6638869 (2003-10-01), Lai
patent: 6650014 (2003-11-01), Kariyazaki
patent: 6770963 (2004-08-01), Wu
patent: 6867490 (2005-03-01), Toyosawa
patent: 2007/0080432 (2007-04-01), Liu et al.
patent: 6-97218 (1994-04-01), None
patent: 2004-193223 (2004-07-01), None
patent: 2004-221320 (2004-08-01), None
patent: 2006-19699 (2006-01-01), None
patent: 10-2005-0100771 (2005-10-01), None
English language abstract of Japanese Publication No. 6-97218.
English language abstract of Japanese Publication No. 2004-221320.
English language abstract of Korean Publication No. 10-2005-0100771.
English language abstract of Japanese Publication No. 2006-19699.

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