Image sensor with a gate electrode between the photoelectric...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device

Reexamination Certificate

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Details

C257S222000, C257S290000, C257S414000, C257S428000, C257S431000, C257SE31037, C257SE31032, C257SE31039

Reexamination Certificate

active

07612392

ABSTRACT:
Example embodiments relate to an image sensor and a fabrication method thereof. An image sensor may include a semiconductor substrate. A charge transfer structure may be formed on the semiconductor substrate. The charge transfer structure may include a gate insulating film that may be formed on a channel region in the semiconductor substrate between a photoelectric conversion region and charge detection region, and a transfer gate electrode that may be formed on the gate insulating film that may have a region doped with a first conductivity type impurity-doped region and a second conductivity type impurity-doped region which may be adjacent to each other.

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patent: 2003/0209743 (2003-11-01), Park
patent: 2006/0180868 (2006-08-01), Maciejewski et al.
patent: 2007/0029587 (2007-02-01), Greer et al.
patent: 2003-174156 (2003-06-01), None
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patent: 10-2004-0008683 (2004-01-01), None
Office Action for corresponding Korean Application No. 10-2005-0093106 dated Sep. 29, 2006and English language translation thereof.

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