Method of manufacturing thick dielectric pattern and method...

Details Method of manufacturing thick dielectric pattern and method... Method of manufacturing thick dielectric pattern and method...

2005-06-27

2009-02-03

Duda, Kathleen (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S319000, C430S330000

Reexamination Certificate

active

07485410

ABSTRACT:
A method of manufacturing a thick dielectric pattern disposed on a substrate. A first precursor layer is formed by imparting a first photosensitive dielectric paste, including a dielectric material, onto a substrate and drying it. A second precursor layer is formed by imparting a second photosensitive dielectric paste, including a dielectric material higher in softening point than the dielectric material included in the first photosensitive dielectric paste, on the first precursor layer and drying it. Precursor patterns are formed by collectively exposing and developing the layered products of the first precursor layer and the second precursor layer through the mask of a predetermined pattern, and a thick dielectric pattern is formed by collectively baking the precursor patterns.

REFERENCES:
patent: 5052033 (1991-09-01), Ikeda et al.
patent: 6866989 (2005-03-01), Watanabe et al.
patent: 2003/0049572 (2003-03-01), Watanabe et al.
patent: 2004/0185379 (2004-09-01), Iha
patent: 2006/0003264 (2006-01-01), Watanabe et al.
patent: 2003-195513 (2003-07-01), None

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