Semiconductor package and method of manufacturing the same

Details Semiconductor package and method of manufacturing the same Semiconductor package and method of manufacturing the same

2007-12-20

2009-10-20

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S678000, C257S686000, C257S780000, C257S784000, C438S107000, C438S613000, C438S617000

Reexamination Certificate

active

07605478

ABSTRACT:
Provided are a semiconductor package and a method of manufacturing the semiconductor package, and more particularly, a semiconductor package with bonding wires and a method of manufacturing the semiconductor package. The semiconductor package includes a substrate including a finger, at least one semiconductor chip stacked on the substrate, the semiconductor chip including a chip pad, and a wire which electrically connects the finger with the chip pad, wherein one end of the wire bonds with an upper surface and lateral surfaces of the finger.

REFERENCES:
patent: 6778406 (2004-08-01), Eldridge et al.
patent: 6937477 (2005-08-01), Wu
patent: 2005/0156303 (2005-07-01), Wu
patent: 09-082742 (1997-03-01), None
patent: 2002-016100 (2002-01-01), None
English language abstract of Japanese Publication No. 09-082742.
English language abstract of Japanese Publication No. 2002-016100.

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