Trench gate type MOS transistor semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S129000, C257S139000, C257S144000, C257S152000, C257S333000, C257S341000, C257S409000, C257SE21384, C257SE29021, C257SE29201, C438S242000, C438S243000

Reexamination Certificate

active

07485921

ABSTRACT:
This semiconductor device comprises a first semiconductor layer of a first conductivity type, an epitaxial layer of a first conductivity type formed in the surface on the first semiconductor layer, and a base layer of a second conductivity type formed on the surface of the epitaxial layer. Column layers of a second conductivity type are repeatedly formed in the epitaxial layer under the base layer at a certain interval. Trenches are formed so as to penetrate the base layer to reach the epitaxial layer; and gate electrodes are formed in the trenches via a gate insulation film. A termination layer of a second conductivity type is formed on the epitaxial layer at an end region at the perimeter of the base layer. The termination layer is formed to have a junction depth larger than that of the base layer.

REFERENCES:
patent: 5034341 (1991-07-01), Itoh
patent: 5894149 (1999-04-01), Uenishi et al.
patent: 6300171 (2001-10-01), Frisina
patent: 6639260 (2003-10-01), Suzuki et al.
patent: 6844592 (2005-01-01), Yamaguchi et al.
patent: 2006/0043478 (2006-03-01), Yamaguchi et al.
patent: 2007/0194375 (2007-08-01), Kawaguchi et al.
patent: 2003-273355 (2003-09-01), None
U.S. Appl. No. 11/936,412, filed Nov. 7, 2007, Ono, et al.
U.S. Appl. No. 11/943,181, filed Nov. 20, 2007, Kawaguchi, et al.

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