Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-01-03
2009-06-09
Lebentritt, Michael S (Department: 2829)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S761000, C438S790000, C257SE21174, C257SE21175, C257SE21243, C257SE21279, C257SE21576, C257SE23161, C257SE29117, C257SE29147
Reexamination Certificate
active
07544614
ABSTRACT:
A slit forming process with respect to a coated film, includes:forming a step pattern having an end part on a substrate;coating a liquid material for forming a coated film on the substrate in the manner of covering at least the end part of the step pattern; andforming the coated film by drying the coated liquid material, together with forming a slit at a position corresponding to the end part of the step pattern.
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Lebentritt Michael S
Oliff & Berridg,e PLC
Seiko Epson Corporation
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