Method of forming a coated film, method of forming an...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S761000, C438S790000, C257SE21174, C257SE21175, C257SE21243, C257SE21279, C257SE21576, C257SE23161, C257SE29117, C257SE29147

Reexamination Certificate

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07544614

ABSTRACT:
A slit forming process with respect to a coated film, includes:forming a step pattern having an end part on a substrate;coating a liquid material for forming a coated film on the substrate in the manner of covering at least the end part of the step pattern; andforming the coated film by drying the coated liquid material, together with forming a slit at a position corresponding to the end part of the step pattern.

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M. I. Elinson in Radio Eng. Electron Phys., 120, 1290 (1965).

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