Thermal interface

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S040000, C257S625000, C257S712000, C257SE21521

Reexamination Certificate

active

07612370

ABSTRACT:
An apparatus including an interface having a number of nanostructures is described. The apparatus comprises heat source, a thermal management device, and an interface disposed between the thermal management device and the heat source. The interface a substrate has a number of nanostructures to facilitate heat transfer and adhesion between the heat source and the thermal management device.

REFERENCES:
patent: 5921087 (1999-07-01), Bhatia et al.
patent: 6094919 (2000-08-01), Bhatia
patent: 6407922 (2002-06-01), Eckblad et al.
patent: 6486489 (2002-11-01), Watanabe et al.
patent: 6730731 (2004-05-01), Tobita et al.
patent: 6831359 (2004-12-01), Heilbronner
patent: 6856016 (2005-02-01), Searls et al.
patent: 6924335 (2005-08-01), Fan et al.
patent: 7060224 (2006-06-01), Edman et al.
patent: 2002/0145194 (2002-10-01), O'Connor et al.
patent: 2003/0143382 (2003-07-01), Xu
patent: 2004/0125565 (2004-07-01), Chen et al.
patent: 2005/0059238 (2005-03-01), Chen et al.
patent: 2005/0105272 (2005-05-01), Prasher

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermal interface does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal interface, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal interface will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4114850

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.