Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2004-04-08
2009-08-25
Menz, Laura M (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S014000, C438S128000, C324S754090
Reexamination Certificate
active
07579269
ABSTRACT:
Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween. In an exemplary application, the spring contact elements are disposed on a semiconductor devices resident on a semiconductor wafer so that temporary connections can be made with the semiconductor devices to burn-in and/or test the semiconductor devices.
REFERENCES:
patent: 3389457 (1968-06-01), Goldman et al.
patent: 3519890 (1970-07-01), Ashby
patent: 4032058 (1977-06-01), Riseman
patent: 4418857 (1983-12-01), Ainslie et al.
patent: 4486945 (1984-12-01), Aigoo
patent: 4674180 (1987-06-01), Zarracky
patent: 4705205 (1987-11-01), Allen et al.
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 4919623 (1990-04-01), Billman et al.
patent: 5059556 (1991-10-01), Wilcoxen
patent: 5067007 (1991-11-01), Otsuka et al.
patent: 5103557 (1992-04-01), Leedy
patent: 5164339 (1992-11-01), Gimpelson
patent: 5172050 (1992-12-01), Swapp
patent: 5195237 (1993-03-01), Cray et al.
patent: 5210939 (1993-05-01), Mallik et al.
patent: 5214375 (1993-05-01), Ikeuchi et al.
patent: 5259768 (1993-11-01), Brunker et al.
patent: 5317479 (1994-05-01), Pai et al.
patent: 5323035 (1994-06-01), Leedy
patent: 5326726 (1994-07-01), Tsang et al.
patent: 5354712 (1994-10-01), Ho et al.
patent: 5366380 (1994-11-01), Reymond
patent: 5391521 (1995-02-01), Kim
patent: 5475318 (1995-12-01), Marcus et al.
patent: 5476211 (1995-12-01), Khandros
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5595942 (1997-01-01), Albrecht et al.
patent: 5600257 (1997-02-01), Leas et al.
patent: 5665648 (1997-09-01), Little
patent: 5710728 (1998-01-01), Danielson et al.
patent: 5723894 (1998-03-01), Ueno et al.
patent: 5731229 (1998-03-01), Kato et al.
patent: 5756370 (1998-05-01), Farnworth et al.
patent: 5772451 (1998-06-01), Dozier, II et al.
patent: 5777328 (1998-07-01), Gooch
patent: 5786270 (1998-07-01), Gorrell et al.
patent: 5789264 (1998-08-01), Chung
patent: 5793174 (1998-08-01), Kovach et al.
patent: 5829128 (1998-11-01), Eldridge et al.
patent: 5832601 (1998-11-01), Eldridge et al.
patent: 5844400 (1998-12-01), Ramsier et al.
patent: 5848685 (1998-12-01), Smith et al.
patent: 5864946 (1999-02-01), Eldridge et al.
patent: 5878292 (1999-03-01), Bell et al.
patent: 5878486 (1999-03-01), Eldridge et al.
patent: 5879963 (1999-03-01), Howe et al.
patent: 5884398 (1999-03-01), Eldridge et al.
patent: 5897326 (1999-04-01), Eldridge et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 5929651 (1999-07-01), Leas et al.
patent: 5930596 (1999-07-01), Klose et al.
patent: 5974940 (1999-11-01), Madni et al.
patent: 5978569 (1999-11-01), Traeger
patent: 5983493 (1999-11-01), Eldridge et al.
patent: 5990646 (1999-11-01), Kovach et al.
patent: 5998228 (1999-12-01), Eldridge et al.
patent: 6032356 (2000-03-01), Eldridge et al.
patent: 6057658 (2000-05-01), Kovach et al.
patent: 6064213 (2000-05-01), Khandros et al.
patent: 6080596 (2000-06-01), Vindasius et al.
patent: 6160517 (2000-12-01), Bell et al.
patent: 6181089 (2001-01-01), Kovach et al.
patent: 6183267 (2001-02-01), Marcus et al.
patent: 6184053 (2001-02-01), Eldridge et al.
patent: 6188231 (2001-02-01), Palagonia
patent: 6245444 (2001-06-01), Marcus et al.
patent: 6259218 (2001-07-01), Kovach et al.
patent: 6351134 (2002-02-01), Leas et al.
patent: 6369530 (2002-04-01), Kovach et al.
patent: 6525555 (2003-02-01), Khandros et al.
patent: 6533926 (2003-03-01), Hawkins et al.
patent: 6537444 (2003-03-01), Wilberscheid et al.
patent: 6655023 (2003-12-01), Eldridge et al.
patent: 6680213 (2004-01-01), Farnworth et al.
patent: 6727580 (2004-04-01), Eldridge et al.
patent: 6788094 (2004-09-01), Khandros et al.
patent: 6856150 (2005-02-01), Sporck et al.
patent: 7059182 (2006-06-01), Ragner
patent: 7078926 (2006-07-01), Khandros et al.
patent: 7116119 (2006-10-01), Sporck et al.
patent: 7142000 (2006-11-01), Eldridge et al.
patent: 7245134 (2007-07-01), Granicher et al.
patent: 7307433 (2007-12-01), Miller et al.
patent: 7345493 (2008-03-01), Khandros et al.
patent: 2001/0050538 (2001-12-01), Kovach et al.
patent: 2002/0003432 (2002-01-01), Leas et al.
patent: 2002/0142494 (2002-10-01), Farnworth et al.
patent: 2002/0144937 (2002-10-01), Wilberscheid et al.
patent: 2002/0144938 (2002-10-01), Hawkins et al.
patent: 2004/0068869 (2004-04-01), Eldridge et al.
patent: 2004/0198081 (2004-10-01), Eldridge et al.
patent: 2004/0257241 (2004-12-01), Menger
patent: 2005/0007257 (2005-01-01), Rast
patent: 2006/0166053 (2006-07-01), Badding et al.
patent: 2006/0171145 (2006-08-01), Ford et al.
patent: 2006/0273809 (2006-12-01), Miller et al.
patent: 2007/0046313 (2007-03-01), Eldridge et al.
patent: 2007/0261009 (2007-11-01), Granicher et al.
patent: 2008/0100320 (2008-05-01), Miller et al.
patent: 2008/0157808 (2008-07-01), Khandros et al.
patent: 0457253 (1991-11-01), None
patent: 58-191453 (1983-11-01), None
patent: 1-150862 (1989-06-01), None
patent: 2-034949 (1990-02-01), None
patent: 2-221881 (1990-09-01), None
patent: 4-240570 (1992-08-01), None
patent: 5-198716 (1993-08-01), None
patent: 6-018555 (1994-01-01), None
patent: 7-209334 (1995-08-01), None
patent: 7-333232 (1995-12-01), None
patent: 8-306708 (1996-11-01), None
patent: WO 95/14314 (1995-05-01), None
Leung et al., “Active Substrate Membrane Probe Card,” Technical Digest of the International Electron Devices Meeting (IEDM) (Oct. 12, 1995), pp. 709-712.
“Method of Testing Chips and Joining Chips to Substrates,” 2244 Research Disclosure No. 322 (Emsworth, Great Britain Feb. 1991).
Weast, “Handbook of Chemistry and Physics,” CRC Press, pp. D-171 to D-172 (Cleveland, Ohio).
U.S. Appl. No. 08/839,761, filed Apr. 15, 1997, Eldridge et al.
U.S. Appl. No. 11/862,751, filed Sep. 27, 2007, Berry.
U.S. Appl. No. 11/861,223, filed Sep. 25, 2007, Berry.
U.S. Appl. No. 12/046,009, filed Mar. 11, 2008, Kemmerling.
U.S. Appl. No. 12/044,600, filed Mar. 7, 2008, Kemmerling.
U.S. Appl. No. 11/960,396, filed Dec. 19, 2007, Kemmerling.
U.S. Appl. No. 12/239,326, filed Sep. 26, 2008, Kemmerling.
Eldridge Benjamin N.
Khandros Igor Y.
Mathieu Gaetan L.
Pedersen David V.
Burraston N. Kenneth
FormFactor Inc.
Menz Laura M
LandOfFree
Microelectronic spring contact elements does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microelectronic spring contact elements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic spring contact elements will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4114360