Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2002-06-11
2009-08-25
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE23021, C257SE23146, C257SE21001, C257SE25012, C257SE23178, C257S723000, C257S678000, C257S779000, C257S780000, C257S781000, C257S773000, C257S737000
Reexamination Certificate
active
07579681
ABSTRACT:
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer level, and integrated circuit modules that include one or more packages are provided. In one embodiment, the die package comprises a redistribution layer interconnecting two or more dies disposed on a substrate, typically a semiconductor wafer, the redistribution layer including a first trace connecting a bond pad of each of two dies, and a second trace connecting one of the bond pads of the two dies to a ball pad. The die package of the invention can comprise memory devices such as static random access memories (SRAMs), and can be incorporated into a variety of electronic systems as part of a memory package such as single in line memory modules (SIMMs) or dual in line memory modules.
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Boon Suan Jeung
Chia Yong Poo
Low Siu Waf
Neo Yong Loo
Ser Bok Leng
Micro)n Technology, Inc.
Whyte Hirschboeck Dudek SC
Williams Alexander O
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