Methods for making substrates and substrates formed therefrom

Details Methods for making substrates and substrates formed therefrom Methods for making substrates and substrates formed therefrom

2007-08-17

2009-11-10

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S455000, C257SE21567, C257SE21568, C257SE21569, C257SE21570

Reexamination Certificate

active

07615468

ABSTRACT:
A method for making substrates for use in optics, electronics, or opto-electronics. The method may include transferring a seed layer onto a receiving support and depositing a useful layer onto the seed layer. The thermal expansion coefficient of the receiving support may be identical to or slightly larger than the thermal expansion coefficient of the useful layer and the thermal expansion coefficient of the seed layer may be substantially equal to the thermal expansion coefficient of the receiving support. Preferably, the nucleation layer and the intermediate support have substantially the same chemical composition.

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